Solder Paste, Soldering Flux, Insulation Welding Paste, Excessive Bonding Power, for Cell Cellphone PCB PGA BGA Welding(CMT-50)

Specification:
Merchandise: Solder Paste
Optionally available Weight: #01 84g/3oz; #02 50g/1.8oz 
Mannequin: CMT-150+; CMT-50(Optionally available)

Bundle Record:
1 x Solder Paste

Be aware: 
Earlier than welding, wipe the floor of the products, drop the paste on the welding place, after which use soldering iron to soften tin on the welding place.

Good moisturizing, vivid and full solder joint, little smoke, no irritating odor.
Much less residual, excessive insulation resistance.
Excessive bonding power, impartial PH worth, clean welding floor.
Simple to weld, no false welding.
Appropriate for cell phone, PC board card and different precision digital chip welding.